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Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

机译:采用开放式和闭环冷却系统的数据中心冷却热力学能效分析和热建模

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There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 500 W/cm~2 in near future. This paper presents several possible closed and open loop cooling schemes for thermal management of electronic equipment in data centers. To be able to identify the overall energy consumption impact, a thermodynamics coefficient of performance (COP) analysis for a data center under each one of the proposed schemes is presented. A limited condition condition 2nd law of thermodynamics thermal efficiency (η_Ⅱ) analysis of the proposed open-loop schemes is also presented. Using available performance data, the overall data center COP of open and closed-loop cooling schemes is evaluated. Also, the 2nd law efficiency of open-loop schemes is evaluated. To properly design and size the components of a liquid or refrigeration-assisted open or closed-loop cooling scheme requires heat exchanger modeling that need to be incorporated in existing CFD simulation models. For that, analytical modeling of two kinds of direct expansion refrigeration cooling evaporator and a secondary liquid cooling fan coil heat exchanger in conjunction with a computational fluid dynamics (CFD) model to analyze a refrigeration cooled high heat density electronic and computer data center installed on a raised floor is presented. Both models incorporate an accurate tube-by-tube thermal hydraulic modeling of the heat exchanger. The refrigeration coil analysis incorporates a multi region heat exchanger analysis for a more precise modeling of two phase refrigerant flow in the evaporator. The single phase secondary loop fan coil heat exchanger modeling uses an effectiveness method for regional modeling of the spot-cooling coil. Using an iterative method, results of the heat exchanger modeling is simultaneously incorporated in the CFD model and an optimal design of spot cooling heat exchanger is developed. The presented cooling schemes, theoretical thermodynamics analysis along with the detailed thermal-hydraulic heat exchanger simulation in conjunction with the state-of-the-art CFD simulation code should enable data center designers to be able to handle expected increased in heat density of the future data centers. A flow cross sectional area (m~2) ANNUL length fraction of the tube with quality up to 0.85 C_P specific heat at constant pressure (kJ/kg °C) COP coefficient of performance d tube diameter (m) h heat transfer coefficient (W/m~2 °C) K tube thermal conductivity (W/m °C) m mass flow rate (kg/hr) NTU number of transfer units PR power ratio Q heat transfer rate (W) T temperature (°C) t air temperature (°C) U overall heat transfer coefficient (W/m2 °C) W power (W) w tube thickness (m) XDRY length fraction of the tube with quality within the range of 0.85 to 1.0
机译:有强有力需要提高热管理和电子冷却的目前能力,因为估计表明IC电力密度水平在不久的将来可以达到500 W / cm〜2。本文提出了几种可能的封闭和开环冷却方案,用于数据中心的电子设备的热管理。为了能够识别整体能量消耗影响,提出了在每个提议方案下数据中心的性能(COP)分析的热力学系数。还提出了有限的条件条件第2章热力学热效率(η_Ⅱ)提出的开环方案的分析。使用可用性能数据,评估开放和闭环冷却方案的整体数据中心COP。此外,评估了开环方案的第二律效率。正确设计和尺寸的液体或制冷辅助开放或闭合回路冷却方案的组件需要热交换器建模需要在现有的CFD模拟模型将被并入。为此,两种直膨胀制冷冷却蒸发器和二次液体冷却风扇卷材热交换器的分析建模结合计算流体动力学(CFD)模型来分析安装在A上的制冷冷却的高热密度电子和计算机数据中心提出凸起地板。两种型号都采用了热交换器的准确管热液压建模。制冷线圈分析包括多区域热交换器分析,用于更精确地建模蒸发器中的两个相制冷剂流动。单相二次环风扇线圈热交换器建模使用了斑点冷却线圈的区域建模的有效方法。使用迭代方法,在CFD模型中同时结合热交换器建模的结果,开发了点冷却热交换器的最佳设计。所提出的冷却方案,理论热力学分析以及详细的热液压热交换器模拟与最先进的CFD仿真码相结合,应使数据中心设计师能够处理未来的热密度增加数据中心。流量横截面积(M〜2)管的长度分数,质量高达0.85c_p特异性热处(kj / kg°C)POP系数D管直径(m)H传热系数(W. / m〜2°C)k管导热率(w / m°C)m质量流量(kg / hr)NTU转移单元数量PR功率比Q传热速率(W)T温度(°C)T空气温度(°C)U总传热系数(W / M2°C)W功率(W)W管厚度(M)管的Xdry长度的质量在0.85至1.0的范围内

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