首页> 外文会议>ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007) >Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems
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Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

机译:使用开环和闭环冷却系统的数据中心冷却的热力学能效分析和热建模

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There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 500 W/cm~2 in near future. This paper presents several possible closed and open loop cooling schemes for thermal management of electronic equipment in data centers. To be able to identify the overall energy consumption impact, a thermodynamics coefficient of performance (COP) analysis for a data center under each one of the proposed schemes is presented. A limited condition condition 2nd law of thermodynamics thermal efficiency (η_Ⅱ) analysis of the proposed open-loop schemes is also presented. Using available performance data, the overall data center COP of open and closed-loop cooling schemes is evaluated. Also, the 2nd law efficiency of open-loop schemes is evaluated. To properly design and size the components of a liquid or refrigeration-assisted open or closed-loop cooling scheme requires heat exchanger modeling that need to be incorporated in existing CFD simulation models. For that, analytical modeling of two kinds of direct expansion refrigeration cooling evaporator and a secondary liquid cooling fan coil heat exchanger in conjunction with a computational fluid dynamics (CFD) model to analyze a refrigeration cooled high heat density electronic and computer data center installed on a raised floor is presented. Both models incorporate an accurate tube-by-tube thermal hydraulic modeling of the heat exchanger. The refrigeration coil analysis incorporates a multi region heat exchanger analysis for a more precise modeling of two phase refrigerant flow in the evaporator. The single phase secondary loop fan coil heat exchanger modeling uses an effectiveness method for regional modeling of the spot-cooling coil. Using an iterative method, results of the heat exchanger modeling is simultaneously incorporated in the CFD model and an optimal design of spot cooling heat exchanger is developed. The presented cooling schemes, theoretical thermodynamics analysis along with the detailed thermal-hydraulic heat exchanger simulation in conjunction with the state-of-the-art CFD simulation code should enable data center designers to be able to handle expected increased in heat density of the future data centers. Aflow cross sectional area (m~2) ANNULlength fraction of the tube with quality up to 0.85 C_Pspecific heat at constant pressure (kJ/kg °C) COPcoefficient of performance dtube diameter (m) hheat transfer coefficient (W/m~2 °C) Ktube thermal conductivity (W/m °C) mmass flow rate (kg/hr) NTUnumber of transfer units PRpower ratio Qheat transfer rate (W) Ttemperature (°C) tair temperature (°C) Uoverall heat transfer coefficient (W/m2 °C) Wpower (W) wtube thickness (m) XDRYlength fraction of the tube with quality within the range of 0.85 to 1.0
机译:迫切需要提高我们当前在热管理和电子冷却方面的能力,因为估计表明IC功率密度水平在不久的将来可能达到500 W / cm〜2。本文提出了几种可能的闭环和开环冷却方案,用于数据中心电子设备的热管理。为了能够确定总体能耗影响,提出了每种提议方案下数据中心的热力学性能系数(COP)分析。给出了所提出的开环方案的热力学热效率(η_Ⅱ)分析的有限条件条件第二定律。使用可用的性能数据,评估开环和闭环冷却方案的整体数据中心COP。此外,还评估了开环方案的第二定律效率。要正确设计和确定液体或制冷辅助开环或闭环冷却方案的组件并确定其尺寸,需要在现有CFD仿真模型中纳入热交换器模型。为此,将两种直接膨胀式制冷冷却蒸发器和辅助液体冷却风扇盘管热交换器的分析模型与计算流体动力学(CFD)模型结合起来,以分析安装在冷却塔上的制冷冷却高热密度电子和计算机数据中心提出了高架地板。两种模型均包含热交换器的精确的逐管热工水力模型。制冷盘管分析结合了多区域换热器分析,可对蒸发器中的两相制冷剂流进行更精确的建模。单相二次回路风扇盘管换热器建模使用一种有效方法对局部冷却盘管进行区域建模。使用迭代方法,将换热器建模的结果同时纳入CFD模型中,并开发了点冷却换热器的优化设计。提出的冷却方案,理论热力学分析以及详细的热工-液压换热器仿真以及最新的CFD仿真代码,应使数据中心设计人员能够应对未来热量密度的预期增长数据中心。恒定压力(kJ / kg°C)时质量最高为0.85 C_P比热的管的流动横截面面积(m〜2)ANNUL长度分数COP性能系数d管直径(m)h传热系数(W / m〜2°C)K管导热率(W / m°C)m质量流量(kg / hr)NTU传输单元数PR功率比Q传热率(W)T温度(°C)t空气温度(°C)U总传热系数(W / m2°C)W功率(W)w管子厚度(m)XDRY质量在0.85至1.0范围内的管子长度分数

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