OPTIMIZATION OF THE TECHNOLOGICAL PARAMETERS FOR THE COPPER ELECTROREFINING USING INTERFERENCE MICROSCOPY AND DIGITAL IMAGE ANALYSI

摘要

Short term electrodeposition experiments (up to 80 min.) at two current densities 220 and 275 A/m~2 with varying concentrations of thiourea and glue were performed to determine the optimum levels of glue, thiourea and current density for industrial copper electrorefining. White Light Interference Microscopy was used to acquire digital images of the morphology of the electrodeposited copper. Scaling analysis was employed to parameterize the morphological information encoded in the images. The limiting roughness, *, the critical scaling length, L_c, and the aspect ratio, 4*/ L_c, were determined as a function of the deposition time and the amount of organic additives. These parameters were used to calculate the dynamic exponent, beta, the roughness exponent, 1/z, and the aspect ratio exponent, y, plotted as a function of glue and thiourea concentrations. These 3D plots allowed us to find conditions corresponding to the minimum of beta and y, at which the deposited copper is characterized by a small roughness and a dense structure.