首页> 外文会议>Conference on Photomask Technology >Evaluation of attenuated PSM photomask blanks with TF11 chrome and FEP-171 resist on a 248 nm DUV laser pattern generator
【24h】

Evaluation of attenuated PSM photomask blanks with TF11 chrome and FEP-171 resist on a 248 nm DUV laser pattern generator

机译:用TF11铬和FEP-171抗蚀剂的衰减PSM光掩模坯料对248 nm duv激光图案发生器的抗蚀剂

获取原文
获取外文期刊封面目录资料

摘要

Tighter requirements on mask resolution, CD and image positioning accuracy at and beyond the 45 nm technology node push the development of improved photomask blanks. One such blank for attenuated phase-shift masks (att-PSM) provides a thinner chrome film, named TF11, with higher chrome etch rate compared to the previous generation Att-PSM blank (NTAR5 chrome film) from the same supplier. Reduced stress in the chrome film also results in less image placement error induced by the material. FEP-171 is the positive chemically amplified resist (PCAR) that is most commonly used in advanced mask manufacturing with both 50 keV variable shaped e-beam (VSB) and DUV laser pattern generators. TF11 allows an FEP-171 resist film down to about 2000 A thickness with sufficient etch resistance, while the standard resist thickness for NTAR5 is around 3000 A. This work has experimentally evaluated the use of TF11 chrome and FEP-171 resist together with a 248 nm DUV laser pattern generator, the Sigma7500. First, patterning performance in resist with thicknesses from 2000 A to 2600 A, in steps of 100 A, was tested with respect to swing curve and basic lithographic parameters including resolution, CD linearity, CD iso-dense bias and dose sensitivity. Patterning results on mask showed a swing minimum at around 2200 A and a swing maximum at around 2500 A, which correspond to reflectivity measurements for 248 nm wavelength performed by the blank supplier. It was concluded that the overall patterning performance was best close to the swing maximum. Thereafter the patterning performance using TF11 at two resist thicknesses, 2000 A and 2550 A, was studied in more detail and compared to performance using NTAR5 with 3200 A resist. The evaluation showed that the Sigma7500-II offers good compatibility with TF11, especially using the optimized FEP-171 resist thickness of 2550 A. It also showed that the patterning capability of the Sigma7500-II using TF11 and 2550 A resist is improved compared to using NTAR5 and 3200 A resist.
机译:在45 nm技术节点和超出45 nm技术节点的掩模分辨率,CD和图像定位精度的更紧密的要求推动改进的光掩模空白的开发。用于减毒的相移掩模(ATT-PSM)的一个这样的空白提供了一个名为TF11的较薄的铬膜,与来自同一供应商的上一代Att-PSM坯料(NTAR5 Chrome薄膜)相比,具有更高的铬蚀刻速率。铬膜中的应力降低也导致材料诱导的图像放置误差较少。 FEP-171是具有50keV可变成形电子束(VSB)和DUV激光图案发生器的高级掩模制造中最常使用的正化学放大抗蚀剂(PCAR)。 TF11允许FEP-171抗蚀剂薄膜下降到大约2000个具有足够耐蚀刻性的厚度,而NTAR5的标准抗蚀剂厚度约为3000A。这项工作实验评价了TF11 Chrome和FEP-171的使用以及248的使用。 NM DUV激光图案发生器,Sigma7500。首先,关于从2000A到2600a的厚度的抗蚀剂的图案化性能相对于摆动曲线和基本光刻参数,包括分辨率,Cd线性,Cd异致偏压和剂量敏感性的旋转曲线和碱性光刻参数。掩模的图案化结果显示在2200A左右的摆动最小值和大约2500a的摆动最大值,其对应于由空白供应商执行的248nm波长的反射率测量。结论是,整体图案化性能最大限度地靠近挥杆最大值。此后,在两个抗蚀剂厚度下使用TF11的图案化性能,更详细地研究了2000A和2550A,并与使用NTAR5的性能相比,使用3200抗抗蚀剂。评价显示SIGMA7500-II与TF11提供良好的兼容性,特别是使用优化的FEP-171抗蚀剂厚度为2550A。它还表明,与使用相比,使用TF11和2550使用TF11和2550的Sigma7500-II的图案化能力得到改善NTAR5和3200抗蚀剂。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号