首页> 外文会议>Conference on Photomask Technology; 20070918-21; Monterey,CA(US) >Evaluation of attenuated PSM photomask blanks with TF11 chrome and FEP-171 resist on a 248 nm DUV laser pattern generator
【24h】

Evaluation of attenuated PSM photomask blanks with TF11 chrome and FEP-171 resist on a 248 nm DUV laser pattern generator

机译:在248 nm DUV激光图案发生器上评估带有TF11铬和FEP-171抗蚀剂的PSM光掩模的衰减空白

获取原文

摘要

Tighter requirements on mask resolution, CD and image positioning accuracy at and beyond the 45 nm technology node push the development of improved photomask blanks. One such blank for attenuated phase-shift masks (att-PSM) provides a thinner chrome film, named TF11, with higher chrome etch rate compared to the previous generation Att-PSM blank (NTAR5 chrome film) from the same supplier. Reduced stress in the chrome film also results in less image placement error induced by the material. FEP-171 is the positive chemically amplified resist (PCAR) that is most commonly used in advanced mask manufacturing with both 50 keV variable shaped e-beam (VSB) and DUV laser pattern generators. TF11 allows an FEP-171 resist film down to about 2000 A thickness with sufficient etch resistance, while the standard resist thickness for NTAR5 is around 3000 A. This work has experimentally evaluated the use of TF11 chrome and FEP-171 resist together with a 248 nm DUV laser pattern generator, the Sigma7500. First, patterning performance in resist with thicknesses from 2000 A to 2600 A, in steps of 100 A, was tested with respect to swing curve and basic lithographic parameters including resolution, CD linearity, CD iso-dense bias and dose sensitivity. Patterning results on mask showed a swing minimum at around 2200 A and a swing maximum at around 2500 A, which correspond to reflectivity measurements for 248 nm wavelength performed by the blank supplier. It was concluded that the overall patterning performance was best close to the swing maximum. Thereafter the patterning performance using TF11 at two resist thicknesses, 2000 A and 2550 A, was studied in more detail and compared to performance using NTAR5 with 3200 A resist. The evaluation showed that the Sigma7500-II offers good compatibility with TF11, especially using the optimized FEP-171 resist thickness of 2550 A. It also showed that the patterning capability of the Sigma7500-II using TF11 and 2550 A resist is improved compared to using NTAR5 and 3200 A resist.
机译:达到和超过45 nm技术节点对掩模分辨率,CD和图像定位精度的更严格要求,推动了改进的光掩模坯料的发展。与相同供应商提供的上一代Att-PSM坯料(NTAR5铬膜)相比,一种这样的用于衰减相移掩模(att-PSM)的坯料可提供更薄的铬膜,称为TF11,具有更高的铬蚀刻速率。铬膜中应力的降低还可以减少由材料引起的图像放置误差。 FEP-171是一种正化学放大抗蚀剂(PCAR),最常用于先进的掩模制造中,同时具有50 keV可变形状电子束(VSB)和DUV激光图案发生器。 TF11允许FEP-171抗蚀剂膜减小到大约2000 A的厚度并具有足够的耐蚀刻性,而NTAR5的标准抗蚀剂厚度约为3000A。这项工作已通过实验评估了TF11铬和FEP-171抗蚀剂与248一起使用的情况。 nm DUV激光图案发生器Sigma7500。首先,针对摆幅曲线和基本光刻参数(包括分辨率,CD线性,CD等密度偏压和剂量敏感性),以100 A的步长测试了厚度为2000 A至2600 A的抗蚀剂中的图案形成性能。掩模上的图案化结果显示,在2200 A附近有一个最小的摆幅,在2500 A附近有一个最大的摆幅,这与空白供应商针对248 nm波长进行的反射率测量相对应。结论是总体构图性能最好接近挥杆最大值。此后,更详细地研究了在2000A和2550A两种抗蚀剂厚度下使用TF11的图案化性能,并将其与在3200A抗蚀剂下使用NTAR5的图案性能进行了比较。评估表明,Sigma7500-II与TF11具有良好的兼容性,特别是使用优化的FEP-171抗蚀剂厚度为2550 A时。它还表明,与使用TF11和2550 A抗蚀剂相比,Sigma7500-II的图案化能力得到了提高NTAR5和3200 A抗蚀剂。

著录项

相似文献

  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号