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Poly-SiGe MEMS actuators for adaptive optics

机译:适用于自适应光学的Poly-SiGe MEMS执行器

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Many adaptive optics (AO) applications require mirror arrays with hundreds to thousands of segments, necessitating a CMOS-compatible MEMS process to integrate the mirrors with their driving electronics. This paper proposes a MEMS actuator that is fabricated using low-temperature polycrystalline silicon-germanium (poly-SiGe) surface-micromaching technology (total thermal budget is 6 hours at or below 425°C). The MEMS actuator consists of three flexures and a hexagonal platform, on which a micromirror is to be assembled. The flexures are made of single-layer poly-SiGe with stress gradient across thickness of the film, making them bend out-of-plane after sacrificial-layer release to create a large nominal gap. The platform, on the other hand, has an additional stress-balancing SiGe layer deposited on top, making the dual-layer stack stay flat after release. Using this process, we have successfully fabricated the MEMS actuator which is lifted 14.6 urn out-of-plane by 290-μm-long flexures. The 2-μm-thick hexagonal mirror-platform exhibits a strain gradient of -5.5x10~(-5) μm~(-1) (equivalent to 18 mm radius-of-curvature), which would be further reduced once the micromirror is assembled.
机译:许多自适应光学(AO)应用程序需要具有数百到数千个段的镜像阵列,因此需要CMOS兼容的MEMS过程,以将镜子与其驱动电子设备集成。本文提出了一种MEMS致动器,使用低温多晶硅 - 锗(Poly-SiGe)表面微量测量技术(总热预算为6小时或低于425°C)。 MEMS致动器由三个弯曲和六边形平台组成,在该偏振平台上由该偏振机组装在其上,可以组装微镜。弯曲由单层多标,具有穿过薄膜厚度的应力梯度,使它们在牺牲层释放后弯曲平面,以产生大的标称间隙。另一方面,该平台具有额外的应力平衡SiGe层,沉积在顶部,使双层堆叠在释放后保持平坦。使用此过程,我们已成功地制造了MEMS致动器,通过290微米的弯曲将14.6 URN抬起。 2μm厚的六边形镜 - 平台表现出-5.5x10〜(-5)μm〜( - 1)(相当于曲率18mm半径的曲率)的应变梯度,这将在微镜的情况下进一步降低组装。

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