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FABRICATION AND APPLICATION OF MICRO SENSOR ARRAYS ON NICKEL SUBSTRATE FOR MESO-SCALE MANUFACTURING PROCESSES

机译:微传感器阵列对镍基材进行微传感器阵列的制造与应用中型尺度制造工艺

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Real time monitoring, diagnosis and control of numerous manufacturing processes is of critical importance in reducing operation costs, improving product quality, and shortening response time. Current sensors used in manufacturing, especially at meso/micro scale, are normally unable to provide measurements with desired spatial and temporal resolution at critical locations in metal structures (e.g. tooling). Micro sensors are expected to offer tremendous benefits for real time sensing in manufacturing processes. In this study, a batch production of micro thin film sensor arrays was realized by transferring thin film sensors from silicon wafers directly onto nickel substrates through standard microfabrication and electroplating techniques. To demonstrate the potential applications, micro sensor arrays that consist of multiple thermocouples and thermopiles were designed, fabricated and transferred into electroplated nickel to study temperature field and heat generation during meso-scale ultrasonic welding. Sensor arrays are arranged immediately adjacent to the meso-scale welding area for in-situ temperature and surface heat flux measurement. These micro sensor arrays provide high spatial and temporal resolution that cannot be achieved with conventional macro sensors.
机译:许多制造过程的实时监测,诊断和控制对于降低运营成本,提高产品质量和缩短响应时间至关重要。制造中使用的电流传感器,特别是在Meso / Micro Scale,通常不能在金属结构的关键位置处提供测量(例如,在临界位置(例如工具)。预计微型传感器将为制造过程中的实时感测提供巨大的益处。在该研究中,通过将从硅晶片的薄膜传感器直接通过标准微加工和电镀技术将薄膜传感器转移到镍基底上来实现微薄薄膜传感器阵列的批量生产。为了展示潜在的应用,设计了由多个热电偶和热处理的微传感器阵列,制造和转移到电镀镍中,以研究中间尺度超声波焊接期间的温度场和发热。传感器阵列立即布置在Meso尺度焊接区域,以便原位温度和表面热通量测量。这些微传感器阵列提供了通过传统宏传感器无法实现的高空间和时间分辨率。

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