High Speed Multi-GHz signaling Using Conventional PCB Designs

摘要

1. New Interconnect PCB Technology is Enabling High Speed Data Transmission 2. PCB High Speed Toolkit includes: 2.1 HDI Building Block Core Technology 2.2 Low Loss Materials 2.3 PTH Stub Reduction and Elimination Alternatives to Backdrill 2.4 Z-interconnect 3. Measurements and Results 3.1 Provide High Speed Backplane Solutions 3.2 AIR MAX VS Connector~TM Demonstrator Board 3.3 Phase I Verified Equivalent Performance to Backdrilled 3.3.1 Demonstrated capability to transmit 6.25 to 50cm, 10 Gbs to 25 cm links 3.4 Phase II Extension incorporates low loss materials 3.4.1 Demonstrated capability to transmit 6.25 to 60cm, 10 Gbs to 3D cm links 4. Future Activities 4.1 Phase III: Implement Full Z-interconnect with HDI building blocks and Mixed Low Loss Materials.