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Integral equation methodologies for the signal integrity analysis of PCB and interconnect structures in layered media from DC to multi-GHz frequencies.

机译:积分方程方法用于从DC到Multi-GHz频率的分层介质中PCB和互连结构的信号完整性分析。

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摘要

Presented is the development of a two-dimensional solver for electrostatic and magneto-quasi-static problems pertinent to the extraction of the per-unit-length frequency-dependent resistance, inductance, capacitance, and conductance for the multiconductor modeling of coupled interconnect structures. In contrast with existing transmission line parameter extractors, this integral equation based field solver relies on a new methodology for constructing the Green's function for the multilayered substrate that provides versatility and efficiency in the modeling of general layered media problems. Such a Green's function is able to include the effects of lossy ground planes and allows conductor cross sections to occupy multiple layers. The result is a versatile and computationally efficient solver that accurately computes transmission line parameters for both shielded and open structures.; Also introduced is a three-dimensional dynamic field solver for the analysis of interconnect structures with electrodynamic properties that cannot be quantified accurately using transmission line theory. To date, the development of electrodynamic integral equation solvers that can handle realistic interconnect and printed circuit board structures has been hindered by the large number of unknowns in the discrete model. While under quasi-static assumptions, fast multipole methods and precorrected FFT methods have been proven very successful in dealing with the computational complexity of such problems. Their extension to the electrodynamic, however, has been hindered by issues such as low frequency numerical instability, the development of electrodynamic Green's functions for lossy layered media, as well as the efficient modeling of the skin effect loss inside the metalization. The aforementioned difficulties are addressed effectively in this thesis through the following contributions. A fast iterative solver based on the low-storage CG-FFT algorithm is combined with the loop-tree decomposition of the unknown current densities to enable DC to multi-GHz numerically stable solutions with complexity that grows linearly with the number of unknowns. A new computational procedure for developing the three-dimensional layered media Green's function based on a Chebyshev polynomial approximation of the spectrum of the spatial Green's function is introduced capable of handling arbitrary, lossy, layered substrates. A model compatible with the CG-FFT methodology is proposed for efficiently handling the frequency dependent field penetration in thick conductors.
机译:提出了一种二维求解器的开发,该求解器用于解决与耦合互连结构的多导体建模中的每单位长度频率相关的电阻,电感,电容和电导的提取有关的静电和磁准静态问题。与现有的传输线参数提取器相比,这种基于积分方程的场求解器依靠一种新的方法来构造多层基板的格林函数,从而为通用层状介质问题的建模提供了多功能性和效率。这种格林函数可以包含有损接地平面的影响,并允许导体横截面占据多层。结果是一种通用且计算效率高的求解器,可准确计算屏蔽结构和开放结构的传输线参数。还介绍了一种三维动态场求解器,用于分析具有电动力学特性的互连结构,而这些结构无法使用传输线理论进行准确量化。迄今为止,由于离散模型中存在大量未知数,阻碍了能够处理实际互连和印刷电路板结构的电动积分方程求解器的开发。在准静态假设下,快速多极方法和预校正FFT方法已被证明在解决此类问题的计算复杂性方面非常成功。但是,它们的扩展受到了诸如低频数值不稳定性,对有损耗的分层介质的电动格林函数的发展以及金属化内部集肤效应损耗的有效建模等问题的阻碍。通过以下贡献,有效解决了上述困难。基于低存储CG-FFT算法的快速迭代求解器与未知电流密度的环路树分解相结合,可以使DC到Multi-GHz数值稳定的解决方案,其复杂度随着未知数的增加而线性增长。引入了一种新的计算程序,用于开发基于空间格林函数谱的切比雪夫多项式近似的三维分层介质格林函数,该函数能够处理任意有损分层衬底。提出了与CG-FFT方法兼容的模型,以有效处理厚导体中与频率相关的磁场穿透。

著录项

  • 作者

    Morsey, Jason David.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2003
  • 页码 144 p.
  • 总页数 144
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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