In this paper, factors that influence the ability for a flex circuit, especially a multilayer flex circuit, to survive the lead-free soldering and other thermal processes during the circuit fabrication processes will be discussed. Results and discussion will be given to demonstrate that the main factors that determine the robustness of a multilayer flex circuit to survive lead-free soldering include: (a) the intrinsic thermal stability of the flex circuit materials used to build the circuit; (b) the multilayer construction of the circuit and related processes making it; and (c) the design of the circuit patterns.
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