New Laminates for High Reliability Printed Circuit Boards

摘要

The challenges for today's PCBs are many, including higher assembly temperatures and higher device heat transfer temperatures; faster clock cycles and higher bandwidths; higher component density; lower noise margins and high current carrying requirements; while maintaining or improving cost/performance ratios and increasing assembly yields and field life. This paper presents the work in Teradyne to characterize and qualify new printed circuit board ("PCB") dielectric substrates (a.k.a. "laminates") to meet the requirements of lead-free assembly, while providing more reliability and flexibility to design engineering. The paper provides details on: A) the drivers and the objectives of the program; B) some key properties of the laminates selected for testing; C) the tests and the results; and D) some discussion and conclusions.