Die-to-Wafer bonding of thin dies using a 2-Step approach; High Accuracy Placement, then Gang Bonding - (PPT)

机译：使用两步方法芯片粘接薄管芯;高精度放置，然后帮合 - （PPT）

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摘要

The push towards 3D; Wafer-to-Wafer Vs Die-to-Wafer; Die to Wafer Bonding Approaches.

机译：推向3D;晶圆到晶片VS芯片晶圆;死于晶圆粘接方法。

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《International Conference and Exhibition on Device Packaging》|2010年||共28页
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作者
Rahul Agarwal; Wenqi Zhang; Paresh Limaye; Riet Labie; A. Phommahaxay; P. Soussan;
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中图分类 TN405.94-53;
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机译：使用两步方法芯片粘接薄管芯;高精度放置，然后帮合 - （PPT）
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Die-to-Wafer bonding of thin dies using a 2-Step approach; High Accuracy Placement, then Gang Bonding - (PPT)

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