WAFER LEVEL STACKING OF 8 TO 10 DICE PER MM FOR CONSUMER PRODUCTS - WIRELESS DIE-ON-DIE 'WDoD'

摘要

The approach which we have used for "WDoD" is similar to the one which we have used as of 1990 when we launched the 3-D interonnection, i.e.: - use of standard components and available off-the-shelf. - test of each level prior to stacking. The use of "WDoD" level process has not fundamentally changed the approach: in fact, we did not choose the same direction as the one which is currently dominant, i.e.: use of non-thinned wafers; use of standard wafers, which means non modified (no interconnection through holes in the silicon); Building of Known Good Rebuilt wafers in order not to be faced again with the problems of multi chips modules and Wafer Scale Integration, which have failed. As far as these large volume productions are concerned, 3D PLUS works as a fabless and as IP provider. We have already identified a foundry and are looking for some others.