Diode Laser Bonding of Planar MEMS, MOEMS, Microfluidic Devices

摘要

The assembly of plastic microfluidic devices, MOEMS and microarrays requiring high positioning and welding accuracy in the micrometer range, has been successfully achieved using a new technology based on laser transmission welding combined with a photolithographic mask technique. This paper reviews a laser assembly platform for the joining of microfluidic plastic parts with its main related process characteristics and its potential for low-cost and high volume manufacturing. The system consists of a of diode laser with a mask and an automated alignment function to generate micro welding seams with freely definable geometries. A fully automated mask alignment system with a resolution of < 2 u,m and a precise, non-contact energy input allows a fast welding of micro structured plastic parts with high reproducibility and excellent welding quality.