首页> 外文会议>Archive of 2005 SPIE digital library conference proceedings amp; journals >DIODE LASER BONDING OF PLANAR MICROFLUIDIC DEVICES, MOEMS, BIOMEMS, DIAGNOSTIC CHIPS MICROARRAYS
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DIODE LASER BONDING OF PLANAR MICROFLUIDIC DEVICES, MOEMS, BIOMEMS, DIAGNOSTIC CHIPS MICROARRAYS

机译:平面微流控器件,MOEMS,生物微机,诊断芯片和微阵列的二极管激光键合

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摘要

The assembly of plastic microfluidic devices, MOEMS and microarrays requiring high positioning andrnwelding accuracy in the micrometer range, has been successfully achieved using a new technology based onrnlaser transmission welding combined with a photolithographic mask technique. This paper reviews a laserrnassembly platform for the joining of microfluidic plastic parts with its main related process characteristicsrnand its potential for low-cost and high volume manufacturing. The system consists of a of diode laser with arnmask and an automated alignment function to generate micro welding seams with freely definablerngeometries. A fully automated mask alignment system with a resolution of < 2 μm and a precise, noncontactrnenergy input allows a fast welding of micro structured plastic parts with high reproducibility andrnexcellent welding quality.
机译:使用基于激光透射焊接的新技术与光刻掩模技术相结合,已经成功实现了塑料微流体器件,MOEMS和微阵列的装配,这些组件在微米范围内具有很高的定位和熔接精度。本文综述了用于连接微流体塑料零件的激光组装平台,其主要相关工艺特征以及其低成本高产量制造的潜力。该系统由一个带防毒面具的二极管激光器和一个自动对准功能组成,可产生自由定义几何形状的微焊缝。分辨率<2μm的全自动掩模对准系统和精确的非接触式能量输入,可实现具有高再现性和出色焊接质量的微结构塑料零件的快速焊接。

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