Optical coupling device and optical coupling method of flip chip bonding laser diode and optical fiber

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device and optical coupling method of a flip chip bonding laser diode and an optical fiber in an optical transmission module which is a laser light source for optical communication. The optical coupling device according to the present invention includes a wire bonding pad and a joint for flip chip bonding that contacts the solder bump of the laser diode on one side and the tapered optical fiber is inserted into a central portion of the one side, A V-groove formed in the V-groove for performing optical alignment with the active region, a silicon substrate mounting portion having a L-shaped overall shape and a silicon substrate to which a tapered optical fiber is fixedly mounted, An optical fiber inserting hole into which an optical fiber is inserted is installed at the center and an epoxy injection hole into which an epoxy for fixing the tapered optical fiber inserted through the optical fiber inserting hole is inserted is provided at one side of the upper surface thereof, And a protruding support member. According to another aspect of the present invention, there is provided a method of optically coupling a laser diode and an optical fiber, comprising the steps of flip-chip bonding a laser diode to a silicon substrate, inserting a tapered optical fiber through an optical fiber insertion hole of a support member, A method of manufacturing a semiconductor device, comprising the steps of: placing a chip-bonded silicon substrate on a silicon substrate supporting means and positioning the optical fiber in the V groove of the silicon substrate, and then aligning the optical fiber; fixing the optical fiber to the silicon substrate; Mounting on the silicon substrate mount of the member, and fixing the silicon substrate, the support member, and the optical fiber and the support member.