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Activation of Arsenic in Epitaxial Hg_(1-x)Cd_(x)Te (MCT)

机译:在外延HG_(1-x)CD_(x)TE(MCT)中激活砷

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This paper reviews arsenic (As) dopant activation processes in the various forms of epitaxial MCT. Extrinsic doping of MCT is an important part of MCT technology and As doping is preferred as it is a shallow acceptor dopant with low diffusivity and 100percent activation can be achieved under the correct growth and/or post-growth annealing conditions. It is, however, amphoteric so that under Te-rich growth conditions it can be incorporated as a donor (As_(Hg)) and under metalrich conditions as an acceptor (As'_(Te)). For As concentrations up to approx2 X 10~(18) cm~(-3) the amphoteric model provides a satisfactory basis for explaining the behavior on annealing layers at temperatures above approx250 deg C. Under Te-rich conditions in LPE- and MBE-grown layers can be either compensated n-type or the As can be inactive. The quantitative model of Schaake is used to obtain an expression for the activation anneal time in terms of As concentration, layer thickness, composition and temperature. Layers grown by MOVPE can show up to 100percent acceptor activation if the stoichiometric conditions during the CdTe growth cycle of the interdiffused multilayer (IMP) process are maintained as metal-rich. In as-grown MBE layers the evidence indicates that As is incorporated in the form of tetramers that can dissociate at higher temperatures. The issue of establishing whether layers are electrically intrinsic at the annealing temperatures used to activate the As acceptor in LPE and MBE layers is also discussed.
机译:本文评论砷(AS)各种形式的外延MCT的掺杂剂激活过程。 MCT的外在掺杂是MCT技术的重要组成部分,并且由于掺杂是优选的,因为它是具有低扩散性的浅受体掺杂剂,并且在正确的生长和/或生长后退火条件下可以实现100次激活。然而,它是两性的,使得在TE的生长条件下,它可以作为供体(AS_(HG))并在金属中的条件下作为受体(作为'_(TE))。对于高达约2×10〜(18)Cm〜(-3)的浓度,两性模型提供了令人满意的基础,用于解释在高于250℃的温度下的退火层上的行为。在LPE和MBE中的TE富含条件下生长的层可以是补偿的n型,或者可以非活动。 Schaake的定量模型用于在浓度,层厚度,组合物和温度方面获得活化退火时间的表达。如果在跨积极的多层(IMP)工艺的CDTE生长周期中的化学计量条件保持为金属富含金属,则MOVPE种植的层可以显示出100℃的受体活化。在以生长的MBE层中,证据表明,如在较高温度下可以解离的四聚体形式中的掺入。还讨论了在用于激活LPE和MBE层中用于激活AS受体的退火温度的内部在用于激活作为受体的退火温度的问题。

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