Improving Printed Circuit Board Plating with Eductor Agitation

摘要

This paper will review eductor agitation systems at PWB installations to improve the electroplating of printed circuit boards. Significant environmental and productivity improvements have been realized through the use of carefully engineered clusters of eductor nozzles. Design parameters, materials of construction, turnover rates and pump selection will be discussed. Reported benefits such as reduced airborne emissions, faster and more uniform plating rates and prevention of solution stratification to improve filtration will be reviewed.