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High Frequency Noise Optimization of Sub-100nm MOSFETs Utilizing Three Dimensional TCAD Simulation

机译:利用三维TCAD仿真,高频噪声优化Sub-100nm MOSFET

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High frequency noise issues with scaled MOSFETs are calculated and analyzed for the purpose of structure optimization utilizing a three dimensional TCAD device simulator, and the following results have been revealed; for the transistors with a gate length less than 100nm, the induced gate noise becomes very sensitive to the gate width because of the higher gate resistance; the gate noise originated from gate resistance for sub-100nm MOSFETs also increases to the level comparable to the induced gate noise; the current concentration by the divot shape between the edge of the gate and STI makes all of the channel noise, induced gate noise, and NFmin worse. These results have shown the possibility of using TCAD for the analysis of the high frequency noise.
机译:利用三维TCAD设备模拟器计算和分析具有缩放MOSFET的高频噪声问题,并分析结构优化的目的,并揭示了以下结果;对于具有小于100nm的栅极长度小于100nm的晶体管,由于较高的栅极电阻,感应栅极噪声对栅极宽度变得非常敏感;源自Sub-100NM MOSFET的栅极电阻的栅极噪声也增加到与感应栅极噪声相当的电平;通过栅极边缘和STI之间的凹陷形状的电流浓度使得所有信道噪声,感应栅极噪声和NFMIN更差。这些结果表明了使用TCAD进行高频噪声分析的可能性。

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