Transmission electron microscopy analysis of tin oxide on an Sn/FeNi42 solder material

摘要

Applications of tin based alloys as lead (Pb)-free solder materials for electronic manufacturing are intensively studied. Spontaneous whisker growth on an electrodeposited tin film has become a serious problem since the whiskers often cause short circuit. It has been pointed out that tin oxides formed on die tin surface may influence the whisker-growth. Transmission electron microscopy (TEM) analysis has been performed to characterize a microstructure of the tin oxides on an Sn/FeNi42 solder material.