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Box Beam Lap Shear Torsion Testing for Evaluating Structural Performance of Adhesive Bonded Joints

机译:盒梁圈剪切扭转测试,用于评估粘合剂粘合接头的结构性能

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In this study, failure strengths of in-plane shear loaded bonded joints were compared with analytical predictions of Shear Loaded Bonded Joint (SLBJ) theory. The investigation was carried out in two phases. Phase I was conducted with a particular focus placed on the effect of bondline thickness on joint strength. These specimens were fabricated using E-glass/epoxy cloth and PTM&W ES6292 two-component paste adhesive. A box beam torsion test fixture was used to apply a shear loading. Phase II was carried out to investigate adhesive and/or adherend variability in SLBJ predictions. These specimens were fabricated using aluminum and carbon adherends with Loctite and Hysol EA9360 paste adhesives. Several joggle (production-style) joints were tested to investigate the effects of joggle adherend on strength of the adhesive joint. Furthermore, a failure analysis was conducted to study the failure mechanism of these joints. Experimental data and SLBJ predictions indicated a decrease in strength as the bondline thickness was increased. SLBJ predictions for thin bondlines were comparable with experimental data, but for thick bondlines SLBJ predictions were lower than the experimental data. Substrate failure of EA9360 specimens resulted in significantly lower experimental data than SLBJ predictions. An accumulation of large plastic strains in thin bondlines resulted in high adherend interlaminar strains and caused substrate failure. The unstable damage development of thick bondlines resulted in adhesive cracking in multiple locations with a cohesive type failure and lower failure strengths than that of the thin bondlines.
机译:在该研究中,将平面内剪切装载的接头的故障强度与剪切装载接头(SLBJ)理论的分析预测进行了比较。调查分两期进行。通过特定的重点进行阶段I,置于粘合线厚度对关节强度的影响。使用E-玻璃/环氧布和PTM&W ES6292双组分浆料粘合剂制造这些样品。盒束扭转试验夹具用于施加剪切载荷。进行II期,以研究SLBJ预测中的粘合剂和/或粘附变异性。使用铝和碳粘附用Loctite和Hysol EA9360浆料粘合剂制造这些样品。测试了几个曲折(制作式)关节以研究曲折贴膜对粘合剂的强度的影响。此外,进行了失败分析以研究这些关节的失效机理。实验数据和SLBJ预测表明,随着键合厚度的增加,强度的降低。薄键线的SLBJ预测与实验数据相当,但对于厚的键合,SLBJ预测低于实验数据。 EA9360标本的衬底衰竭导致实验数据明显低于SLBJ预测。薄键线中大塑料菌株的积累导致高粘物层间菌株并引起基材衰竭。厚杆状线的不稳定损伤发展导致多个位置的粘合剂裂缝,粘性型失效和低于薄键合的故障强度。

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