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Microneedle array and insertion guide array for safe use of biomedical applications

机译:微针阵列和插入引导阵列,用于安全使用生物医学应用

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A new method of using silicon microneedle array in Bio-Medical applications is introduced in this work. The hollow microneedle array with the facilitation of an insertion guide array have been designed and fabricated. The needles can be pushed down through the second layer of human skin with less-bending. The tip of microneedle will be led by the insertion guide to pierce the skin perpendicularly. The silicon bulk micromachining technique using an inductively coupled plasma (ICP) etcher has been employed to fabricate the microneedle array and the insertion guide array. The array chips are 5x5 mm~2 for both structures. The needle array chip contains 100 microneedles with 100μm and 30μm of the outer diameter and the hole diameter respectively. The guide array chip is 100 μm-thick and contains 100 guiding holes with 120μm diameter. A buckling test of microneedle shows the result that there was no microneedle broken during the test via the guiding holes. Contrary, there were several microneedles broken during the penetration without the facilitation of the guide. The finite-element analysis also supports the test result. After the insertion with guiding has been tested and proved, a wet etching process was added in order to obtain sharper tips.
机译:在这项工作中介绍了在生物医疗应用中使用硅片微针阵列的新方法。设计和制造具有促进插入引导阵列的空心微针阵列。可以通过较少弯曲的弯曲压力通过第二层人体皮肤。微针的尖端将由插入引导件引导,以垂直地刺穿皮肤。已经采用了使用电感耦合等离子体(ICP)蚀刻器的硅片微机械化技术来制造微针阵列和插入引导阵列。两个结构的阵列芯片为5x5 mm〜2。针阵芯片含有100微型微型,分别具有100μm和30μm的外径和孔直径。引导阵列芯片为100μm厚,并包含100个直径为120μm的引导孔。微针的屈曲试验显示了通过引导孔在测试期间没有破碎的显微粒度。相反,在渗透过程中有几微针破裂,而不会促进导向器。有限元分析还支持测试结果。在测试并证明引导引导的情况下,加入湿蚀刻过程以获得更清晰的尖端。

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