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Advancing Microsystem Technologies Through Electroplated Nanostructures

机译:通过电镀纳米结构推进微系统技术

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Factors affecting reliability and performance are the main concerns when dealing with microsystem components/devices with continuously shrinking external dimensions. In particular, microstructural non-uniformities leading to materials property variations across the microcomponent have presented major challenges. However, recent developments in the field of electroplated nanocrystalline materials can offer an avenue to address many of these technical difficulties. In this paper, the deficiencies of metallic microsystem components currently in use are addressed, followed by a comparison which shows how nano-electroplated microcomponents can alleviate these problems. Materials properties enhancements that are achievable as a result of having nanostructured microcomponents will be discussed. The effects of grain size reduction on several specific performance indicators such as elastic energy storage capacity and wear resistance will be examined.
机译:影响可靠性和性能的因素是处理具有连续缩小外部尺寸的微系统组件/设备的主要问题。特别是,微观结构的非均匀性导致微型组分的材料性能变化呈现了重大挑战。然而,电镀纳米晶体材料领域的最新发展可以提供途径以解决许多技术困难。在本文中,解决了当前使用的金属微系统组件的缺陷,然后进行了比较,显示了纳米电镀微型组合如何缓解这些问题的比较。将讨论由于具有纳米结构微容量而可实现的材料性能增强。将研究晶粒尺寸降低对几种特定性能指标的影响,例如弹性储能能力和耐磨性。

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