Conventional low pH (2.3-3.5) baths, for the electrodeposition of CoFe and CoFeNi thin films, suffer from stability problems. In addition, voids can form in the deposits due to the electroplating of hydrogen. New, more stable baths with relatively high pH levels have been developed by introducing a stabilizer. The effects of stabilizer dosage, bath Co/Fe concentration ratios and plating temperature on the deposition of CoFe and CoFeNi thin films have been investigated. CoFe and CoFeNi thin films with good magnetic properties have been plated out from the newly developed plating baths.
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