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A Direct Plate Process for ABS and ABS/PC without use of Pd Catalyst or High Chrome Etch

机译:ABS和ABS / PC的直接板工艺而无需使用PD催化剂或高铬蚀刻

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This paper outlines the process sequence and performance tests for decorative plated plastics, which have been plated using a new process containing no palladium and very low concentration of Cr VI salts. The function and influence of each process step on the final performance requirements of adhesion and appearance of the plated parts will be discussed. Surface analytical and morphological changes in the surface will also be examined as function of process conditions in an attempt to better understand the mechanism of surface reaction and adhesion with the new process. The benefits of such a process are significant for cost, environmental, and productivity reasons in decorative plating of ABS and ABS/PC blends.
机译:本文概述了装饰镀层塑料的过程序列和性能测试,该镀塑料已经使用不含钯和非常低的Cr VI盐的新方法镀。将讨论每个工艺步骤对镀敷件的最终性能要求的每个工艺步骤的功能和影响。表面的表面分析和形态变化也将作为过程条件的功能检查,以便更好地理解表面反应的机制和与新工艺的粘附。这种过程的好处对于ABS和ABS / PC混合物的装饰镀层中的成本,环境和生产率原因是显着的。

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