tin alloys; silver alloys; copper alloys; yttrium compounds; solders; particle reinforced composites; surface mount technology; crystal microstructure; shear strength; wetting; composite lead free solders; surface mount technology; reinforcement particles; RMA flux; solder paste; composite solder microstructure; rare earth oxides; solder joint shear strength; lead free solder; solder wetting properties; SnAgCu; Y/sub 2/O/sub 3/;
机译:基于液滴制造工艺的无铅锡球工艺参数研究
机译:粉末冶金技术制备不同混合参数的SnCu /碳无铅复合焊料的实验设计
机译:通过电沉积工艺制备用于无铅焊料的多壁碳纳米管增强的Sn纳米复合材料
机译:新型制造工艺对新型复合无铅焊料的评估
机译:基于统计的微电子应用整体式和复合式无铅焊料的蠕变和剪切行为评估。
机译:通过3D打印结合沸石焊接来制造机械坚固无粘合剂的结构化沸石:CO2捕集的卓越配置
机译:无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究