This paper reports the printed circuit board improvements enabled by Henkel and Cavist’s Low Pressure Molding process. As electronic devices continue their dramatic move toward finer pitches and more fragile components with reduced dimensions, manufacturing processes for these parts have become more complex and often more costly. This has proven true for many manufacturing processes including traditional encapsulant and molding techniques. Recently, however, a low pressure molding material and process were introduced that dramatically reduce costs, provide a simple one-step molding alternative and deliver measurable improvements in manufacturing efficiency. This paper will discuss the new Macromelt? low-pressure molding process and materials and illustrate how several manufacturers have successfully incorporated the new technique for such diverse products as automotive and industrial sensors, consumer electronics and general wire and cable harness assemblies while realizing tremendous process and cost improvements. The Macromelt? process, enabled by polyamide and polyolefin hot-melt materials along with the specialized Moldman? dispensing system of The Cavist Corporation delivers a fast and convenient packaging solution by encapsulating circuitry and forming the outer shell of the component all in one step. Switching to this unique and simple process from traditional liquid encapsulation can yield savings in material volume in the range of 20-80%. The paper will compare conventional injection molding and potting processes to the Macromelt? technique and explain how this simple solution is delivering tremendous manufacturing advantages.
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