【24h】

TRACER DIFFUSION IN WHISKER-PRONE TIN PLATINGS

机译:晶须普通锡镀膜中的示踪剂扩散

获取原文

摘要

Surprisingly, after almost 60 years of research into the causes of tin whisker formation, very little experimental evidence exists to verify some of the basic mechanisms believed to be involved in whisker growth. Long range diffusion of tin is thought to occur in order to supply the amount of tin required to form a whisker, however, no direct experimental data to support the long range diffusion hypothesis has been generated. The objective of this study was to use tin isotopes and secondary ion mass spectroscopy (SIMS) to evaluate the room temperature self-diffusion of tin within whisker-prone tin platings (bright and matte tin). Tin diffusion was monitored through the plating thickness and also parallel to the substrate by using SIMS surface analysis and depth profiling techniques. The amount of each isotope that was incorporated into the whiskers that formed and variations in the isotopic percentages along the length of each whisker were quantified (before and after sputtering of the whiskers).
机译:令人惊讶的是,经过近60年的研究成因锡须形成的原因,非常少的实验证据来验证据信的一些基本机制涉及晶须增长。认为锡的长距离扩散是为了提供形成晶须所需的锡量,然而,没有产生支持长距离扩散假设的直接实验数据。本研究的目的是使用锡同位素和二次离子质谱(SIMS)来评估罐装内锡的室温自扩散(明亮和哑光锡)。通过电镀厚度监测锡扩散,并通过使用SIMS表面分析和深度分析技术平行于基板。掺入晶须中形成和变化的每个同位素的量量化沿着每个晶须的长度的同位素百分比的变化(在晶须的溅射之前和之后)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号