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ELECTRICAL PROPERTIES OF InN GROWN BY MOLECULAR BEAM EPITAXY

机译:分子束外延所生长的INN电气特性

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The basic properties of indium nitride (InN) are becoming understood due to advancement in growth techniques using molecular beam epitaxy. GaN and AlN buffers permit thick InN layer growth with reproducible structural, electrical and optical properties. Improved electrical properties include reduction in electron density in undoped InN and increased mobility as a function of InN layer thickness. Surface and interface electron accumulation add significant conductivity that is extracted for determination of the electron density profile. Electrochemical CV profiles confirm surface electron accumulation. Surface chemical exposures further raise electron accumulation. Early applications of low bulk, high surface, electron density InN include near-surface THz emission and electrochemical sensing. These effects result from surface electron accumulation of 2-3 x 10~(13) cm~(-2) sheet density.
机译:由于使用分子束外延的生长技术的进步,氮化铟(INN)的基本性质变得理解。 GaN和Aln缓冲液允许厚厚的inn层生长,具有可重复的结构,电气和光学性能。改进的电气性质包括在未掺杂的套管中的电子密度降低,并且随着驾驶层厚度的函数增加的迁移率。表面和接口电子累积增加了提取的显着的导电性,以确定电子密度分布。电化学CV型材确认表面电子积聚。表面化学曝光进一步提高电子积累。低散装,高表面,电子密度套的早期应用包括近表面THz发射和电化学传感。这些效果由表面电子堆积为2-3×10〜(13)cm〜(-2)张薄薄的薄层。

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