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Fabrication Method of SOI-Based Single-Electron Transistor with in-Plane Side Gates

机译:基于SOI的单电子晶体管的制造方法,具有平面侧门

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Single-electron transistor (SET), which operates with one or a few electrons utilizing Coulomb blockade effect and single electron tunneling effect, is a new kind of nanoelectronic device. In this paper, a silicon-based SET with in-plane side gates is fabricated on silicon-on-insulator (SOI) substrates using electron beam lithography (EBL) and inductively coupled plasma (ICP) dry etching, and its electrical characteristics is measured. The fabrication process is as follows: the 30-nm-thick superficial Si layer of the p-type, (100)-oriented SIMOX (separation by implanted oxygen) wafer is phosphorus doped by ion implantation and rapidly annealed for electrical activation. The SET structure with Coulomb island weakly in connection with source and drain regions and with in-plane side gates near the island is patterned using SAL601 negative resist under EBL. The resist pattern is transferred to the superficial Si film by ICP etching with CHF_3 gas. The constrictions between the island and the source and drain serve as the tunneling barriers. Then a 50-nm-thick SiO_2 film is deposited by PECVD to fill the clearance between the island and the source, drain and gates. Finally the SiO_2 on source, drain, gates region is removed using photolithography and wet etching. The source, drain, gate electrodes are formed by evaporation of Al, stripping and annealing. Carefully controlled the structure, the SET with a 70-nm-radius Coulomb island is successfully fabricated. When the temperature decreases from the room temperature to 20 K, the resistance between source and drain, R_(ds), increases from several MΩ to several GΩ. The Coulomb staircases in the source-drain current (I_(ds)) from the I_(ds)-V_(ds) characteristics and the differential conductance (dI_(ds)/dV_(ds)) oscillations from the dI_(ds)/dV_(ds)-V_(ds) characteristics are clearly observed at different gate voltage (V_g) at 2 K. The good reproducibility of the Coulomb staircases in I_(ds)-V_(ds) curve is observed. This kind of silicon-based SET has the advantages of simplicity, IC-orientation and compatibility with traditional CMOS process.
机译:单电子晶体管(设定)与利用库仑封锁效应的一个或多个电子操作,是一种新型纳米电子器件。在本文中,具有面内侧栅极的基于硅的SET是在硅 - 绝缘体(SOI)衬底使用电子束光刻(EBL)和电感耦合等离子体(ICP)干法蚀刻制造,并且它的电特性进行测定。制造过程如下:p型的30nm厚的浅表性Si层,(100)的Simox(通过注入的氧气分离)晶片是通过离子注入掺杂的磷,并迅速退火用于电活化。使用SAL601负抗蚀剂在EBL下与源区和漏极区域弱源和漏区和漏极区附近的与面侧门有弱的组结构。用CHF_3气体通过ICP蚀刻将抗蚀剂图案转移到浅表Si膜上。岛和源和排水之间的收缩用作隧道障碍。然后通过PECVD沉积50nm厚的SiO_2薄膜,以填充岛和源极,排水管和栅极之间的间隙。最后,使用光刻和湿法蚀刻去除源极,漏极的SiO_2。通过蒸发Al,剥离和退火来形成源极,漏极,栅电极。小心地控制结构,成功制造了具有70 nm半径库仑岛的设定。当温度从室温减小到20K时,源极和漏极之间的电阻R_(DS),从几MΩ增加到几个GΩ。来自I_(DS)-V_(DS)特性的源极 - 漏极电流(I_(DS))的库仑楼梯(I_(DS))和来自DI_(DS)/的差分电导(DI_(DS)/ DV_(DS))振荡/在不同的栅极电压(V_G)下在2k处清楚地观察到DV_(DS)-V_(DS)特性。观察到I_(DS)-V_(DS)曲线中的库仑楼梯的良好再现性。这种基于硅的组具有简单性,IC方向和与传统CMOS工艺的兼容性的优点。

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