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Fabrication Method of SOI-Based Single-Electron Transistor with in-Plane Side Gates

机译:具有面内侧栅的基于SOI的单电子晶体管的制造方法

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Single-electron transistor (SET), which operates with one or a few electrons utilizing Coulomb blockade effect and single electron tunneling effect, is a new kind of nanoelectronic device. In this paper, a silicon-based SET with in-plane side gates is fabricated on silicon-on-insulator (SOI) substrates using electron beam lithography (EBL) and inductively coupled plasma (ICP) dry etching, and its electrical characteristics is measured. The fabrication process is as follows: the 30-nm-thick superficial Si layer of the p-type, (100)-oriented SIMOX (separation by implanted oxygen) wafer is phosphorus doped by ion implantation and rapidly annealed for electrical activation. The SET structure with Coulomb island weakly in connection with source and drain regions and with in-plane side gates near the island is patterned using SAL601 negative resist under EBL. The resist pattern is transferred to the superficial Si film by ICP etching with CHF_3 gas. The constrictions between the island and the source and drain serve as the tunneling barriers. Then a 50-nm-thick SiO_2 film is deposited by PECVD to fill the clearance between the island and the source, drain and gates. Finally the SiO_2 on source, drain, gates region is removed using photolithography and wet etching. The source, drain, gate electrodes are formed by evaporation of Al, stripping and annealing. Carefully controlled the structure, the SET with a 70-nm-radius Coulomb island is successfully fabricated. When the temperature decreases from the room temperature to 20 K, the resistance between source and drain, R_(ds), increases from several MΩ to several GΩ. The Coulomb staircases in the source-drain current (I_(ds)) from the I_(ds)-V_(ds) characteristics and the differential conductance (dI_(ds)/dV_(ds)) oscillations from the dI_(ds)/dV_(ds)-V_(ds) characteristics are clearly observed at different gate voltage (V_g) at 2 K. The good reproducibility of the Coulomb staircases in I_(ds)-V_(ds) curve is observed. This kind of silicon-based SET has the advantages of simplicity, IC-orientation and compatibility with traditional CMOS process.
机译:单电子晶体管(SET)是一种新型的纳米电子器件,它利用库仑阻挡效应和单电子隧穿效应对一个或几个电子进行操作。在本文中,使用电子束光刻(EBL)和电感耦合等离子体(ICP)干法刻蚀在绝缘体上硅(SOI)衬底上制造了具有面内侧栅的硅基SET,并测量了其电特性。制作过程如下:通过离子注入对磷掺杂磷,并对其进行快速退火以进行电激活,该工艺是将p型,(100)取向的SIMOX(通过注入的氧气进行分离)晶圆的30 nm厚的表面Si层进行掺杂。使用SAL601负性抗蚀剂在EBL下对具有库仑岛与源极和漏极区之间以及与岛附近的面内侧栅极连接较弱的SET结构进行构图。通过使用CHF_3气体的ICP蚀刻,将抗蚀剂图案转移到表面Si膜上。岛与源和排水之间的收缩部成为隧道的屏障。然后通过PECVD沉积厚度为50 nm的SiO_2膜,以填充岛与源极,漏极和栅极之间的间隙。最后,使用光刻和湿法蚀刻去除源极,漏极,栅极区域上的SiO_2。源极,漏极,栅电极是通过蒸镀铝,剥离和退火形成的。仔细控制结构,成功制造出半径为70 nm的库仑岛的SET。当温度从室温降至20 K时,源极和漏极之间的电阻R_(ds)从几MΩ增加到几GΩ。由I_(ds)-V_(ds)特性产生的源漏电流(I_(ds))中的库仑阶梯和dI_(ds)/中的差分电导(dI_(ds)/ dV_(ds))振荡dV_(ds)-V_(ds)特性在2 K的不同栅极电压(V_g)下清晰可见。库仑阶梯在I_(ds)-V_(ds)曲线中具有良好的重现性。这种基于硅的SET具有简单,IC定向以及与传统CMOS工艺兼容的优点。

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