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High Speed Alumina Nanotemplate Fabrication on Silicon Substrate

机译:硅衬底高速氧化铝纳米块制造

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Alumina nanotemplates integrated on silicon substrate with pore diameters of 12 nm to 100 nm were prepared by galvanostatic anodization. High current density (e.g. 100 mA.cm~(-2)) promoted a highly ordered hexagonal pore structure with fast formation rate independent of anodizing solutions, where 2000 nm/min, 1000 nm/min were achieved at current densities of 100 mA.cm~(-2) and 50 mA.cm~(-2), respectively. These rates were approximately two orders of magnitude greater than other reports in the literature. Different electrolytes of sulfuric acid (1.8 to 7.2 M), oxalic acid (0.3 M) and mixed solutions of sulfuric and oxalic acid were evaluated as anodizing solutions. Sulfuric acid promoted smaller pore diameter with lower porosity than mixed acids and oxalic acid. The I-V characteristics strongly depend on solution composition, temperature, and bath agitation. In the case of sulfuric acid, the breakdown voltage (U_B) varied linearly with logarithmic of sulfuric acid concentration (U_B = 24.5-11 log [H_2SO_4]) and it decreased at higher temperature. The pore diameter of silicon-integrated alumina nanotemplate varied linearly with measured voltage with a slope of 2.1 nm/V, which is slightly smaller than reported data on bulk aluminum (2.2 nm/V and 2.77 nm/V). Thermoelectric Bi_2Te_3 nanowires with diameter of 43 nm were electrodeposited.
机译:通过Galvanostatic阳极氧化制备孔径直径为12nm至100nm的硅衬底上的氧化铝纳米预期。高电流密度(例如100 mA.CM〜(-2))促进了高度有序的六边形孔隙结构,与阳极溶液无关的快速形成速率,其中2000nm / min,1000nm / min在100 mA的电流密度下实现。 CM〜(-2)和50 mA.CM〜(-2)。这些速率大约比文献中的其他报告大约两个数量级。硫酸(1.8至7.2M),草酸(0.3M)和硫酸和草酸混合溶液的不同电解质被评价为阳极溶液。硫酸促进孔径小于孔隙率低于混合酸和草酸。 I-V特性强烈取决于溶液组成,温度和浴搅拌。在硫酸的情况下,击穿电压(U_B)随着硫酸浓度的对数而变化(U_B = 24.5-11 log [H_2SO_4]),在较高温度下降低。硅集成的氧化铝纳米块的孔径线性变化,测量电压具有2.1nm / v的斜率,其略小于报告的块状铝(2.2nm / v和2.77nm / v)。电沉积,具有直径为43nm的热电Bi_2Te_3纳米线。

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