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Understanding the Operating Expense Relationships of Layouts on Excimer Photo Tools

机译:了解在准分子照片工具上布局的运营费用关系

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Chip size as a function of field fill on wafer layouts, and their effect on thruput, has been well understood as a loss of both opportunity and cost of operation (COO), as a function of depreciated capital expense. The resultant effects on consumable replacement time, expense and budgeting has not been as clear-cut. This paper will outline the consequences that field till has with respect to increased laser, and litho tool optic train, consumable usages as well as availability detractors to replace these components. Resulting losses due to increased cost of operation, and additional consumable spending and usages will be explored.
机译:芯片尺寸作为现场填充晶圆布局的函数,以及它们对Thruput的影响,已被很好地理解为机会的损失和操作成本(COO),作为折旧资本费用的职能。由此产生的耗材替代时间,费用和预算造成的影响并非如同澄清。本文将概述现场对激光的影响,以及Litho工具光学列车,消耗品用法以及可用性批量替代商来替换这些组件。由于运营成本增加而导致损失,并将探讨额外的消费支出和使用。

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