Laser micromachining of thin films for optoelectronic devices and packages

摘要

Focused laser micromachining in an optical microscope system is used to prototype packages for optoelectronic devices and to investigate new materials with potential applications in packaging. Micromachined thin films are proposed as mechanical components to locate fibres and other optical and electrical components on opto-assemblies. This paper reports prototype structures which are micromachined in silicon carbide to produce beams 5μm thick by (ⅰ) laser cutting a track in a SiC coated Si wafer, (ⅱ) undercutting by anisotropic silicon etching using KOH in water, and (ⅲ) trimming if necessary with the laser system. This approach has the advantage of fast turn around and proof of concept. Mechanical test data are obtained from the prototype SiC beam package structures by testing with a stylus profilometer. The Youngs modulus obtained for chemical vapour deposited silicon carbide is 360 +/-SO GPa indicating that it is a promising material for packaging applications.