High-speed NiP Process for Connector Applications

摘要

Thin gold coatings applied over electrolytic NiP have been proposed to be an alternative for conventional nickel/gold systems for connector applications. In addition to its functional benefits, the reduction of applied gold thickness enables a reduction in overall cost. It is important that the phosphorous content in the deposit be maintained at a minimum of 11-12% in order to achieve the desired corrosion resistance. Current systems are able to meet this requirement only at lower current densities. A new electrolytic NiP process has been developed that allows operation at current densities of up to 35 ASD with a cathode efficiency of 60%. The deposit was shown to have a high phosphorous content of >11% over a wide CD range.