High-speed NiP Process for Connector Applications

摘要

Thin gold coatings applied over electrolytic NiP have been proposed to be an alternative forconventional nickel/gold systems for connector applications. In addition to its functionalbenefits, the reduction of applied gold thickness enables a reduction in overall cost. It isimportant that the phosphorous content in the deposit be maintained at a minimum of 11-12% inorder to achieve the desired corrosion resistance. Current systems are able to meet thisrequirement only at lower current densities. A new electrolytic NiP process has been developedthat allows operation at current densities of up to 35 ASD with a cathode efficiency of 60%. Thedeposit was shown to have a high phosphorous content of > 11% over a wide CD range.