Study on Evaluation Method of Wire Bondability by Dynamic Stress Analysis

摘要

Wire bonding conditions are important for the reliability of semiconductor devices. Then, a method for evaluating the wire bondability by using dynamic stress analysis was studied. It was shown that the bondability at interfaces is able to be evaluated by using the equivalent plastic strain as an evaluation factor: The equivalent plastic strain at bonding interfaces is increased by applying the load and ultrasonic vibration to the capillary. It is considered that this method is effective for evaluating the wire bondability.