Impact Stresses in Wire and Wire Bonds: Upper Limit Analysis.

机译：线材和线材中的冲击应力：上限分析。

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An analysis is made of the stresses produced on a wire bond within a rectangular flat-pack during a flatwise upside-down impact on a rigid floor. The formulas developed imply rather significant wire stresses and bond forces. (Author)

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作者
Libove, C.;
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年度 1978
页码 1-17
总页数 17
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Electric wire; Bonding; Circuit interconnections; Stress testing; Impact tests; Drop tests; Flat pack circuits; Mathematical models; Strain(Mechanics); Velocity; Kinetic energy; Specific gravity; Aluminum; Wire bonds; Electric connectors; Bonded joints;

机译：电线;粘接;电路互连;压力测试;冲击试验;跌落试验;扁平电路;数学模型;应变（力学）;速度;动能;比重;铝;引线键合;电连接器;键合接头;

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Impact Stresses in Wire and Wire Bonds: Upper Limit Analysis.

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