Reliability of Active Metal brazing Copper Joint Body Substrate

摘要

The fractures of ceramics-metal joint body semiconductor substrate are caused by the thermal stress and the residual stress due to the thermal stress produced in the manufacturing process and thermal cycle. In this study, the thermal cyclic test and four-point bending test were carried out. Moreover, residual stress was analyzed and strength deterioration due to the thermal cyclic stress was discussed, and the fracture strength of the substrate was evaluated on the basis of fracture mechanics.