Investigation of the Thermal Simulation Model of Power Semiconductor Device Using Design of Experiments

摘要

In the development of a new switch mode power supply (SMPS), the detailed thermal assessment of the entire system is a very time-consuming and expensive process. Therefore, the development of an engineering tool that can drastically reduce both time and cost required by the development process is strongly desired. This paper describes the investigation of the thermal simulation model of power semiconductor devices using design of experiments.