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Simulation model for design of semiconductor device, thermal drain noise analysis method, simulation method, and simulation apparatus

机译:半导体器件设计的仿真模型,散热噪声分析方法,仿真方法和仿真装置

摘要

A semiconductor device simulation method includes the step of storing, in a storage unit, a surface potential and threshold voltage obtained by computation, the step of computing thermal drain noise on the basis of the data of the surface potential and thermal drain noise stored in the storage unit, and the step of determining whether or not to reduce thermal drain noise, and reflecting the computation result in simulation of the model when it is determined that thermal drain noise is to be reduced. A drain current Ids of a MOSFET is calculated and substituted into a relational expression for a drain current noise spectrum density obtained from a Nyquist theorem equation, thereby calculating a thermal drain noise coefficient γ of the MOSFET by substituting the current Ids into a relational expression for a thermal drain noise spectrum density which is obtained from the Nyquist logical equation.
机译:半导体器件模拟方法包括以下步骤:将通过计算获得的表面电势和阈值电压存储在存储单元中;基于存储在半导体器件中的表面电势和热噪声的数据,计算热噪声的步骤。存储单元,以及确定是否减小散热噪声的步骤,并且当确定要减小散热噪声时将计算结果反映在模型的仿真中。计算MOSFET的漏极电流I ds ,并将其代入从奈奎斯特定理方程获得的漏极电流噪声频谱密度的关系式中,从而通过代入来计算MOSFET的散热噪声系数γ将电流I ds 转换成热耗散噪声频谱密度的关系表达式,该关系表达式是从奈奎斯特逻辑方程式获得的。

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