Design Guidelines and Rules for Effective Yield in Manufacturing and Assembly of Printed Circuit Boards Utilizing Surface Mount Technology

摘要

This paper presents a review of work done in the area of design for assembly of printed circuit boards (PCBs) in the surface mount technology (SMT) domain. The paper considers PCB design concerns such as component selection, land pattern geometry design, component layout/spacing requirements and design requirements for fine-pitch devices. It concludes with a checklist of design criteria to enable evaluation of a PCB design against assembly oriented design guidelines.