Micromachining and MEMS show they are disruptive technologies to realize numerous devices ranging from communication, computer peripherals, consumer electronics (i.e., 3C), automotive, aeronautics, and biomedical etc. System-in-a-package (SiP), which can squeeze and integrate two or more bare dies into one multichip module or a package, shows its comparative strength to system-on-chip (SoC) in shorter development time, lower R&D cost, and faster design modification corresponding to applications with fast moving market specifications. Micromachining is promising to provide diversified approaches to realize SiP. Combining the micromachining, wafer level packaging and MCM technologies can make a system-in-a-package device in a new and cost-effective way. A microfabrication and manufacturing platform built in APM aiming at fulfilling these applications is a major business interest in APM. Future collobration and joint development with design house, component and module makers, and system makers are welcome.
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