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High-Performance AlGaInAs/InP 14xx-nm Semiconductor Pump Lasers for Optical Amplifications

机译:高性能AlGainAs / InP 14xx-NM半导体泵激光器进行光放大

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This paper reviews recent progress of high-power 14xx-nm pump lasers using AlGalnAs/InP material. This material has superior temperature characteristics to conventional InGaAsP/InP. As a result, it is more suitable for high current and high efficiency operations as well as uncooled applications for the high power 14xx-nm lasers, which are required for advanced optical amplifications. The laser module consists of a laser chip coupled to a fiber lens and mounted on a thermoelectric cooler in a standard butterfly package. The wavelength of the laser can be stabilized with an external fiber Bragg grating (FBG). We have demonstrated a maximum module fiber output power of 550mW at 1.75A and characteristic temperatures of T_0 = 99K and T_1 = 348K over a range of chip heat-sink temperatures from 15°C to 50°C. To the best of our knowledge, these are the highest efficiency and temperature characteristics from a single-mode 14xx-nm semiconductor laser module capable of over 0.5W fiber output power. At a chip heat-sink temperature of 70°C, a power of 360mW was obtained for a laser module with FBG, which is the highest reported to date for any wavelengths from 1300nm to 1600nm and would enable uncooled applications of the 14xx-nm lasers in the future.
机译:本文介绍了使用藻类/ INP材料的高功率14xx-nm泵激光器的最近进展。该材料具有较高的温度特性,以传统的InGaAsp / InP。结果,更适合于高电流和高效操作以及高功率14xx-nm激光器的未加工应用,这是先进光学放大所必需的。激光模块由耦合到纤维镜头的激光芯片组成,并安装在标准蝶形封装中的热电冷却器上。激光的波长可以用外纤维布拉格光栅(FBG)稳定。我们已经证明了最大模块光纤输出功率为1.75A的1.75A,T_0 = 99K的特性温度和T_1 = 348K在一系列芯片散热温度从15°C到50°C。据我们所知,这些是能够超过0.5W光纤输出功率的单模14xx-nm半导体激光模块的最高效率和温度特性。在70°C的芯片散热器温度下,为具有FBG的激光模块获得360mW的功率,其最高报告的任何波长为1300nm至1600nm,并且可以实现14xx-nm激光器的未加工应用在将来。

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