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INVESTIGATION OF COPLANAR GROUND INDUCTOR DESIGN AND PERFORMANCE ON LAMINATES

机译:对层压板共面条地面电感设计和性能的研究

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This paper presents a study of circular integral inductors (microstrip and embedded microstrip) on FR4 laminates using conventional design rules. There are no special materials or process to avoid extra manufacturing costs, and hence makes integral inductors desirable. The design focuses on coplanar type of inductor structures, which eliminates a ground plane to achieve a high Q factor. The performance of a discrete and integral inductor is compared. The parasitic coupling between closely packed inductors are also investigated. An integral inductor footprint (layout) library is suggested to encourage more users.
机译:本文介绍了使用传统设计规则在FR4层压板上的圆形积分电感器(微带和嵌入式微带)的研究。没有特殊的材料或过程来避免额外的制造成本,因此使得整体电感器是可取的。该设计侧重于共面的电感器结构,消除了地面平面以实现高Q因子。比较了离散和积分电感的性能。还研究了紧密包装电感器之间的寄生耦合。建议一个积分电感概要(布局)库鼓励更多用户。

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