LEAD-FREE SOLDER PASTES FOR SOLDERING PRINTED AND HYBRID CIRCUITS

摘要

The new lead-free solder pastes that were proposed by the European Committee for use in the electronics industry are not appropriate for both: printed-circuits-board (PCS) and hybrid-circuit applications because of the different materials for soldering and soldering pads. For this reason the compatibility of those solder pastes with all the materials used in printed and hybrid circuits must be carefully tested. The basic properties of the investigated lead-free solder pastes such as viscosity, tackiness, slump, solder ball, wettability, ionic contamination and corrosivity were tested in the laboratory for both printed circuits and hybrid circuits.