PARAMETER STUDY FOR THE RELLABILITY OF UNDERFILLED FLIP CHIP AND CSP ASSEMBLIES

摘要

In this paper, an extensive parameter sensitivity study is performed in order to analyse the solder joint reliability of underfilled flip chip assemblies. Using non-linear 3D finite element modelling, the induced inelastic strains in the solder joints are calculated. The size of these strains can be transformed into an estimation of the solder joint reliability, expressed as number of temperature cycles to failure. The influence of several design parameters are analysed and verified by experimental work found in literature. Examples of parameters are the chip size dimensions and underfill properties.