This paper presents a novel technique for measurement of solder paste deposits in electronics production. The printing process is the most critical step in surface mount assembly, with the highest fraction of defects attributed to it. To reliably control and monitor printing, complex instrumentation is available for measuring the print volume, height and edge definition with high level of confidence. Data from such techniques are essential in product development, SPC and quality control. This study describes a robust measurement technique and algorithm for solder paste deposits or other materials, which are used in electronics production processes such as SM adhesive and glob-tops applications. The significant advantage of the algorithm is in its robustness, which can accommodate unlevelled surfaces, rotated or mispositioned samples or even measurement noise. The technique is able to filter out these imperfections and give a stable reading. The main parameters are comparable with different aperture shape/size, which makes this tool ideal for SPC in production or material product development. This technique can be used on a spectrum of commercially available scanning instruments to and analyse various aspects of stencil printing and dispensing.
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