3D interconnects formed at wafer level allow for increased device functional density and reduced total packaging costs. Aligned wafer bonding is a key enabling technology for stacking wafers. The paper will review current status of aligned wafer bonding and recent advances in process technology. Face-to-face alignment (SmartView) is the established technology for micron level alignment. A description of the process steps and latest results will be demonstrated. Subsequent thermo-compression bonding employs various different intermediate layers. The paper will give an overview of bonding agents and technologies. Today equipment for both R&D and high volume production is available. Examples of typical recipe configurations will be shown.
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