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Intimate morphology of Au-nGaN contacts for the configuration of near ideal Schottky diodes

机译:Au-nggan接触的贴心形态,用于近乎理想的肖特基二极管的配置

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The intimate configuration of gold Schottky contacts formed in-situ on n-type GaN grown by MOVPE on A1_2O_3 (0001) substrates as a function of the semiconductor surface treatment prior to metallisation, has been investigated by X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM). Two approaches are described: (ⅰ) the deposition of several monolayers of elemental Ga, followed by annealing at 900°C, and (ⅱ) annealing at 600°C. Samples metallised following method (ⅰ) exhibit an intermixed morphology leading to poor ideality factors and lower barrier heights of Schottky contacts. Conversely, for the 600°C annealed samples, the interface is abrupt and non-reacted. Current-voltage (I-V) measurements also indicate the highest barriers yet reported (1.2-1.3 eV), with very low ideality factors (n=1.03).
机译:通过在金属化之前的A1_2O_3(0001)基板上由MOVPE生长的N型GaN上形成的金肖特基触点的亲密结构是通过在金属化之前进行的半导体表面处理的函数,并通过X射线光电子能谱(XPS)和透射电子显微镜(TEM)。描述了两种方法:(Ⅰ)几种元素Ga的沉积,然后在900℃下退火,(Ⅱ)在600℃下退火。样品金属化后的方法(Ⅰ)表现出混合形态,导致肖特基触点的较差的理想因素和较低的屏障高度。相反,对于600°C退火样品,界面突然和非反应。电流 - 电压(I-V)测量还指示报告的最高障碍(1.2-1.3eV),非常低的理想因子(n = 1.03)。

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